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HomeHealth & BeautyBeauty & Personal CarePersonal CareShave & Hair RemovalMen's GroomingTweezers27Pcs Universal Directly Heat BGA Reballing Net Stencils Tem
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₦ 9,310
₦ 17,69047%
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+ shipping from ₦ 2,379 to LEKKI-AJAH (SANGOTEDO)
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Delivery Fees ₦ 2,379
Ready for pickup between 22 May and 26 May if you place your order within the next 20hrs 41mins
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Delivery Fees ₦ 3,339
Ready for delivery between 22 May and 26 May if you place your order within the next 20hrs 41mins
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YoMandy
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Product details
Description:
These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate.
Can be heated by the hot air machine, these stencils are not easy to deform when heated.
Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable.
It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
Specificationss:
Material: 304 stainless steel
Color: as shown
Stencils
Specificationss: as the picture
Quantity: 27 PCS/Set
Weight: 60g
Package Included:
27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.
These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate.
Can be heated by the hot air machine, these stencils are not easy to deform when heated.
Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable.
It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
Specificationss:
Material: 304 stainless steel
Color: as shown
Stencils
Specificationss: as the picture
Quantity: 27 PCS/Set
Weight: 60g
Package Included:
27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.
Specifications
Key Features
- These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate
- Can be heated by the hot air machine, these stencils are not easy to deform when heated
- Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform
- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball
- It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering
What’s in the box
27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.
Specifications
- SKU: GE779ST7U869ANAFAMZ
- Model: 无型号
- Size (L x W x H cm): 9x8x1
- Weight (kg): 0.073
- Color: N/A
- Main Material: metal
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27Pcs Universal Directly Heat BGA Reballing Net Stencils Tem
₦ 9,310
₦ 17,69047%
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