HomeHome & OfficeOffice ProductsOffice & School SuppliesBinders & Binding SystemsMultifunction BGA Stencil 0.30.350.40.5Parallel45 Degree Hole Universal Solder Template BGA Reballing Stencil
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Multifunction BGA Stencil 0.30.350.40.5Parallel45 Degree Hole Universal Solder Template BGA Reballing Stencil

₦ 21,646
₦ 36,70341%

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+ shipping from ₦ 4,538 to LEKKI-AJAH (SANGOTEDO)
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Delivery Fees ₦ 4,538
Ready for pickup between 22 May and 26 May if you place your order within the next 21hrs 30mins

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Delivery Fees ₦ 5,498
Ready for delivery between 22 May and 26 May if you place your order within the next 21hrs 30mins

Return Policy

Free return within 7 days for ALL eligible itemsDetails

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Product details

Model Number: CPU BGA Reballing ​Stencil

Applicaiton:for Android Phone Repair

Thickness:0.12MM

Material:steel

colour:silver

Package Contents:

1 * BGA Stencil

Only the above package content, other products are not included.

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.


We confidently assure you'll be satisfied with what you get.However, If  there's a chance that you are not satisfied with our goods or something else, please let us know before leaving us a Negative feedback. We will try our best for 100% customer satisfaction. Your 5-Star Positive Feedback is much appreciated to us, and your satisfaction is our greatest motivation to move forward.Welcome to Shop Here! Want more Items? Please come & visit our SHOP.


*Shipping and Packaging All it will be double checked and well packed before sending.It will be dispatched within 5 business days after buyers pay for the order. It usually takes about 14 to 18 working days for delivering the package to the destination(for remote areas,it may take a little longer).Your satisfaction is our first priority.

*If you receive the order and it is in good condition,we would be grateful if you would leave us 5 star Positive Feedback for the transaction.

Specifications

Key Features

  • Model Number: CPU BGA Reballing ​Stencil
  • Applicaiton:for Android Phone Repair
  • 1 * BGA Stencil
  • Only the above package content, other products are not included.
  • Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

What’s in the box

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Specifications

  • SKU: GE779SN6AOAGNNAFAMZ
  • Product Line: kissmiss
  • Model: oBf3065213
  • Production Country: China
  • Weight (kg): 0.02
  • Color: Multi
  • Main Material: N/A

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Multifunction BGA Stencil 0.30.350.40.5Parallel45 Degree Hole Universal Solder Template BGA Reballing Stencil

Multifunction BGA Stencil 0.30.350.40.5Parallel45 Degree Hole Universal Solder Template BGA Reballing Stencil

₦ 21,646
₦ 36,70341%
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