Home Computing Computers Computer Components Fans & Cooling CPU Cooling FansThermal Conductive Paste For CPU Chipset Cooling 20ml

product_image_name-Generic-Thermal Conductive Paste For CPU Chipset Cooling 20ml-1

product_image_name-Generic-Thermal Conductive Paste For CPU Chipset Cooling 20ml-2

Share this product

Thermal Conductive Paste For CPU Chipset Cooling 20ml

₦ 3,300

In stock

+ shipping from ₦ 750 to LEKKI-AJAH (SANGOTEDO)

0 out of 5

(No ratings available)

Promotions

Call 07006000000 To Place Your Order Need extra money? Loan up to N500,000 on the JumiaPay Android app. Enjoy cheaper shipping fees when you select a PickUp Station at checkout.

Report incorrect product information

Delivery & Returns

Choose your location

Pickup Station

Delivery Fees ₦ 750

Ready for pickup between 16 July and 17 July if you place your order within the next 19hrs 19mins

Door Delivery

Delivery Fees ₦ 1,710

Ready for delivery between 16 July and 17 July if you place your order within the next 19hrs 19mins

Return Policy

Free return within 7 days for ALL eligible itemsDetails

Seller Information

Kendycz clothing

86%Seller Score

80 Followers

Seller Performance

Shipping speed: Good

Quality Score: Good

Customer Rating: Good

Product details

Thermal Grease Paste helps your electrical and electronic appliances in thermal conductivity and heat dissipation, by ensuring that the components, and the device as a whole achieve maximum stability in their performance.

Features:

High stability & reliability
Apply to : CPU, VGA, LED, Chipset and other PC components
Packing: syringe
Easy operation
Helps effectively dissipate heat from processor to radiator
Suitable for: radiator, processor or chips
Low thermal resistance, high conductivity , high temperature resistance
Non-toxic, tasteless, not aggressive
Compliance with RoHS REACH PFOS requirements
Net weight: 30g
Grey thermal paste
Thermal conductivity: greater than 1.90 W /m-k
Thermal resistance : less than 0.225C - in/wThermal Grease Paste helps your electrical and electronic appliances in thermal conductivity and heat dissipation, by ensuring that the components, and the device as a whole achieve maximum stability in their performance.

Features: