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PIERTOELECT.NIG.LIMITED
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MECHANIC XGZ40 183℃ Leaded Solder Tin Paste
New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
Adapted to the mobile phone repair industry, computer digital service industries and high-precision circuit board soldering SMT/BGA soldering processes.
Specification:
--Ms : 25-45um
--Alloy : Sn63/Pb37odel : XG-Z40/XG-30/XG-40/XG-50/XG-80
--Type : Paste
--Weight : 16g/35g/42g/60g
--Micron
--Melting Point : 183℃
--Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing.
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