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BGA Desoldering Wick (HWY-3515)

₦ 6,500

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+ shipping from ₦ 750 to LEKKI-AJAH (SANGOTEDO)

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Product details

The BGA Desoldering Wick (HWY-3515) is a high-quality copper braid used to absorb and remove unwanted solder from electronic components, particularly on Ball Grid Array (BGA) packages. The model number 3515 indicates a width of 3.5mm and a length of 1.5m.

Features & Specifications:

Material: It is made of fine, braided copper wire, which is a good conductor of heat.
Dimensions:
- Width: 3.5mm
- Length: 1.5m
Flux: The wick is pre-coated with a flux, which helps remove surface oxides and makes the solder flow easily into the braid.
Safety: The packaging, often a plastic bobbin, is often static-free to prevent electrostatic discharge (ESD) that can damage sensitive components.
Use: It is suitable for removing solder bridges, repairing joints, and clearing pads for component replacement.

How to use desoldering wick:

Prepare your tools: Ensure your soldering iron is hot and its tip is clean and tinned.
Position the wick: Place the end of the desoldering wick directly over the solder you want to remove.
Apply heat: Press the hot soldering iron tip onto the wick. The heat will transfer through the braid, melting the solder underneath.
Absorb the solder: The braided copper, with the help of the flux, will absorb the molten solder through capillary action.
Lift off: When the solder is absorbed, remove both the soldering iron and the wick at the same time to prevent the wick from soldering to the board.
Discard used wick: Cut off the portion of the wick that is now saturated with solder and discard it. Use a fresh section for any remaining solder.

BGA desoldering & reballing:

While a standard desoldering wick can be used for cleanup, removing and reballing a full BGA package is much more complex due to the solder balls being under the chip.

BGA (Ball Grid Array): A type of surface-mount package for integrated circuits where solder balls are arranged in a grid on the underside.
Standard wick limitation: Standard desoldering wick cannot be used to remove a BGA package, as the solder is hidden underneath the component.
Specialized equipment: Special equipment, such as a reflow oven or rework station, is required for safely removing and reballing BGA components.
Cleanup: The BGA wick is useful for cleaning up any residual solder from the pads after a BGA component has been removed.

Specifications

Key Features

BGA desoldering & reballing:

While a standard desoldering wick can be used for cleanup, removing and reballing a full BGA package is much more complex due to the solder balls being under the chip.

BGA (Ball Grid Array): A type of surface-mount package for integrated circuits where solder balls are arranged in a grid on the underside.
Standard wick limitation: Standard desoldering wick cannot be used to remove a BGA package, as the solder is hidden underneath the component.
Specialized equipment: Special equipment, such as a reflow oven or rework station, is required for safely removing and reballing BGA components.
Cleanup: The BGA wick is useful for cleaning up any residual solder from the pads after a BGA component has been removed.