A-13 IC Chip BGA Reballing Stencil Kits Set Tin Plate For IPhone 11 / 11 Pro / 11 Pro Max

1. Professional tool for mobile phones repairing.

2. Suitable for iPhone 11 / 11 Pro / 11 Pro Max.

3. The unique holes design makes it easier to take out the formed solder balls.

4. This stencil is easy to use no matter you are a new or expert.

5. Special design enables stencil to align with tinning position of CPU rapidly.

6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.

7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.

8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.

9. Special steel manufacturing, high temperature resistance, no deformation.

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