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Shipped from abroad

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

₦ 7,912
₦ 15,82450%

In stock

+ shipping from ₦ 2,195 to LEKKI-AJAH (SANGOTEDO)

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Shipped from abroad 

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Delivery Fees ₦ 2,195
Arriving at pickup station between 14 May & 20 May when you order within next 13hrs 41mins

Door Delivery

Delivery Fees ₦ 2,475
Ready for delivery between 14 May & 20 May when you order within next 13hrs 41mins

Return Policy

Free return within 7 days for ALL eligible itemsDetails

Seller Information

flowerrain

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Order Fulfillment Rate: Poor

Quality Score: Excellent

Customer Rating: Good

Product details

100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

Specifications

Key Features

BGA Stencil

Specifications

  • SKU: GE779IP20XQPUNAFAMZ
  • Weight (kg): 0.07

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Verified Ratings (1)

4/5
4 out of 5

1 verified rating

Comments from Verified Purchases(1)

4 out of 5

BGA is very good

Nice equipment, I love it

30-06-2023by Ajao sarafa Olalekan
Verified Purchase
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

₦ 7,912
₦ 15,82450%
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