HomePhones & TabletsMobile Phone AccessoriesAccessory Combo Packs25000pcs/bottle 0.2-0.65mm Bga Reballing Balls Leaded For Ic Chip Soldering Accessories Solder Ball Tin Material Sn63/pb37 Rewor
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25000pcs/bottle 0.2-0.65mm Bga Reballing Balls Leaded For Ic Chip Soldering Accessories Solder Ball Tin Material Sn63/pb37 Rewor

₦ 41,275
₦ 71,58642%

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+ shipping from ₦ 7,973 to LEKKI-AJAH (SANGOTEDO)
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Delivery Fees ₦ 7,973
Ready for pickup between 02 July and 04 July if you place your order within the next 15hrs 11mins

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Delivery Fees ₦ 8,933
Ready for delivery between 02 July and 04 July if you place your order within the next 15hrs 11mins

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Free return within 7 days for ALL eligible itemsDetails

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Product details

  • Origin:Cn(origin)
  • Design:Bar

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Specifications

Key Features

  • Origin:Cn(origin)
  • Design:Bar

What’s in the box

1*Mobile phone circuit accessories

Specifications

  • SKU: GE779EA520QVPNAFAMZ
  • Model: sjpeijian-98451
  • Production Country: China
  • Size (L x W x H cm): N/A
  • Weight (kg): 0.6
  • Color: 0.25mm
  • Main Material: plastic material

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25000pcs/bottle 0.2-0.65mm Bga Reballing Balls Leaded For Ic Chip Soldering Accessories Solder Ball Tin Material Sn63/pb37 Rewor

25000pcs/bottle 0.2-0.65mm Bga Reballing Balls Leaded For Ic Chip Soldering Accessories Solder Ball Tin Material Sn63/pb37 Rewor

₦ 41,275
₦ 71,58642%
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