27 In 1 IC Repair Thin Tool Remover For IPhone BGA

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Description:

Phone BGA Remover is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone.
Ensure the safety during the repair process.
Ultra-thin will offer the best solution to pry out the easily without any damage.
Perfect cleaning tool for removal on phone motherboard.
27 kinds of set which can meet most of the cleaning or repairing operation on motherboard.

Specification:

Material: Metal
Size: Approx. 5*4.5 cm/1.97*1.77 inch

Package Includes:

1 Set BGA Repair Tool

BGA Repair Tool Set;BGA Remover Tool;BGA ;CPU Remover Burin;IC Repair

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