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HomeIndustrial & ScientificRaw MaterialsMetals & AlloysBronzeBronze WireBGA Fly Repair Superfine For Silver Mechanic Fine Wire FXV009 Soldering Ultra IPhone Chip Line 200m 0.009mm Jump Fingerprint
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Shipped from abroad

BGA Fly Repair Superfine For Silver Mechanic Fine Wire FXV009 Soldering Ultra IPhone Chip Line 200m 0.009mm Jump Fingerprint

₦ 35,400
₦ 59,00040%

In stock

+ shipping from ₦ 7,005 to LEKKI-AJAH (SANGOTEDO)
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Delivery & Returns

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Pickup Station

Delivery Fees ₦ 7,005
Arriving at pickup station between 14 June & 20 June when you order within next 2hrs 33mins

Door Delivery

Delivery Fees ₦ 7,285
Ready for delivery between 14 June & 20 June when you order within next 2hrs 33mins

Return Policy

Free return within 7 days for ALL eligible itemsDetails

Seller Information

Kevin Sinclair

50%Seller Score

5 Followers

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Seller Performance

Order Fulfillment Rate: Very Poor

Quality Score: Excellent

Product details

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Specifications

Key Features

  • Application：motherboardfingerprintrepair

  • MeltingPoint：SuperfineFlyingLineJumpWire

  • Diameter：0.009mm

  • ModelNumber：MechanicFXV009Ultra-fineSilverWireFlyLine

  • Weight：0.1kg

  • Material：SilverJumpWire

  • ModelNumber：MechanicFXV009

  • FluxContent：length:200m

  • Item：MechanicFXV009SuperfineSilverJumpWire

  • Application2：mainboardfingerprintmaintenanceflightline

  • Feature：foriphoneboardchipconductorwire

  • Feature2：forPCBBGASoderingPoint

  • Type：motherboardfingerprintrepairjumperwire

What’s in the box

1×Welding Tools

Specifications

  • SKU: GE779IP3X60PNNAFAMZ
  • Model: JSJSD03212
  • Production Country: China
  • Size (L x W x H cm): 12 x 13 x 15
  • Weight (kg): 0.52
  • Color: 0.009MM
  • Main Material: Synthetic

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BGA Fly Repair Superfine For Silver Mechanic Fine Wire FXV009 Soldering Ultra IPhone Chip Line 200m 0.009mm Jump Fingerprint

BGA Fly Repair Superfine For Silver Mechanic Fine Wire FXV009 Soldering Ultra IPhone Chip Line 200m 0.009mm Jump Fingerprint

₦ 35,400
₦ 59,00040%
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